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Electronics-and-communication-engineering0
Engineering Physics II (View More...)
| Module No. # 03 | lec13 | 46:19 to 48:39 | VIDEO | |
| Module No. # 03 | lec15 | 04:55 to 09:00 | VIDEO | |
| Module No. # 03 | lec15 | 12:22 to 15:52 | VIDEO |
Transmission Lines and EM Waves (View More...)
| Boundary Conditions at Media Interface | lec20 | 11:38 to 14:55 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 14:55 to 16:56 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 20:20 to 23:02 | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 56:42 to upto | VIDEO | |
| Interface Electronics for MEMS | lec31 | 04:16 to 09:59 | VIDEO | |
| Interface Electronics for MEMS | lec31 | 09:59 to 14:13 | VIDEO |
VLSI Circuits (View More...)
| Introduction to VLSI Design | lec1 | 09:53 to 24:01 | VIDEO | |
| Design Flow of VLSI Circuits | lec23 | 17:00 to 25:29 | VIDEO | |
| Xilinx Place and Route Tool | lec34 | 12:06 to 13:36 | VIDEO |
Wireless Communication (View More...)
| The Modern Wireless Communication Systems | lec3 | 00:34 to 00:37 | VIDEO | |
| Wireless Networks | lec36 | 00:04 to 00:04 | VIDEO | |
| Wireless Networks | lec36 | 00:06 to 00:07 | VIDEO |
Advanced Optical Communication (View More...)
| Basics of Light | lec2 | 48:49 to upto | VIDEO | |
| Ray Model I | lec3 | 04:25 to 08:55 | VIDEO | |
| Ray Model I | lec3 | 08:55 to 11:26 | VIDEO |