Engineering Physics II (View More...)
| Module No. # 03 | lec13 | 46:19 to 48:39 | VIDEO | |
| Module No. # 03 | lec15 | 04:55 to 09:00 | VIDEO | |
| Module No. # 03 | lec15 | 12:22 to 15:52 | VIDEO |
Transmission Lines and EM Waves (View More...)
| Basic Laws of Electromagnetics | lec18 | 35:02 to 38:35 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 11:38 to 14:55 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 14:55 to 16:56 | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 56:42 to upto | VIDEO | |
| Interface Electronics for MEMS | lec31 | 04:16 to 09:59 | VIDEO | |
| Interface Electronics for MEMS | lec31 | 09:59 to 14:13 | VIDEO |
Advanced Optical Communication (View More...)
| Integrated Optics II | lec29 | 06:15 to 13:03 | VIDEO | |
| Integrated Optics II | lec29 | 13:03 to 18:22 | VIDEO | |
| Integrated Optics II | lec29 | 18:22 to 23:21 | VIDEO |
High Speed Devices and Circuits (View More...)
| GaAs and InP devices for Microelectronics | lec11 | 22:21 to 26:04 | VIDEO | |
| GaAs and InP devices for Microelectronics | lec11 | 33:39 to 35:40 | VIDEO | |
| GaAs and InP devices for Microelectronics | lec11 | 35:40 to 37:24 | VIDEO |