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Electronics-and-communication-engineering0
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MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 23:29 to 27:55 | VIDEO | |
| MEMS Materials | lec5 | 17:58 to 24:19 | VIDEO | |
| MEMS Materialâs Properties | lec6 | 09:55 to 14:21 | VIDEO |
VLSI Technology (View More...)
| Crystal Structure contd | lec5 | 45:37 to upto | VIDEO | |
| Defects in Crystal + Crystal growth | lec6 | 10:54 to 11:38 | VIDEO | |
| Defects in Crystal + Crystal growth | lec6 | 12:41 to 16:10 | VIDEO |
High Speed Devices and Circuits (View More...)
| GaAs and InP devices for Microelectronics | lec11 | 05:44 to 13:44 | VIDEO | |
| Epitaxial Techniques for GaAs High Speed Devices | lec9 | 05:14 to 13:28 | VIDEO | |
| Epitaxial Techniques for GaAs High Speed Devices | lec9 | 14:55 to 17:25 | VIDEO |