Engineering Physics II (View More...)
| Module No. # 03 | lec13 | 06:53 to 11:03 | VIDEO | |
| Module No. # 03 | lec13 | 13:24 to 17:52 | VIDEO | |
| Module No. # 03 | lec13 | 17:52 to 19:00 | VIDEO |
Solid State Devices (View More...)
| Carrier Transport (Contdâ¦) | lec14 | 15.06 to 16:07 | VIDEO | |
| Carrier Transport (Contdâ¦) | lec14 | 16.47 to 19:20 | VIDEO | |
| Carrier Transport (Contdâ¦) | lec14 | 16:07 to 16.47 | VIDEO |
MEMS and Microsystems (View More...)
| MEMS Microsensors Thermal | lec16 | 52:28 to 53:52 | VIDEO | |
| Introduction to Microsensors | lec2 | 22:52 to 24:36 | VIDEO | |
| Temperature Drift and Damping Analysis | lec23 | 10:22 to 12:56 | VIDEO |
High Speed Devices and Circuits (View More...)
| MBE and LPE for GaAs Epitaxy | lec10 | 02:23 to 03:26 | VIDEO | |
| Requirements for High Speed Circuits, Devices and Materials | lec2 | 10:30 to 17:16 | VIDEO | |
| Requirements for High Speed Circuits, Devices and Materials | lec2 | 36:04 to 46:14 | VIDEO |