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Electronics-and-communication-engineering0
Engineering Physics II (View More...)
| Module No. # 03 | lec13 | 46:19 to 48:39 | VIDEO | |
| Module No. # 03 | lec15 | 04:55 to 09:00 | VIDEO | |
| Module No. # 03 | lec15 | 12:22 to 15:52 | VIDEO |
Transmission Lines and EM Waves (View More...)
| Boundary Conditions at Media Interface | lec20 | 11:38 to 14:55 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 14:55 to 16:56 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 20:20 to 23:02 | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 56:42 to upto | VIDEO | |
| Interface Electronics for MEMS | lec31 | 04:16 to 09:59 | VIDEO | |
| Interface Electronics for MEMS | lec31 | 09:59 to 14:13 | VIDEO |