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Digital Voice and Picture Communication (View More...)
| Computational Aspects of LPC Parameters | lec11 | 13:19 to 16:42 | VIDEO | |
| Computational Aspects of LPC Parameters | lec11 | 36:29 to 40:14 | VIDEO | |
| Cholesky Decomposition and Durbinâs Recursive Approach | lec12 | 25:16 to 29:23 | VIDEO |
MEMS and Microsystems (View More...)
| Mems Inertial Sensors | lec20 | 50:07 to 51:30 | VIDEO | |
| Micromachined Micrometer for MEMS | lec21 | 19:56 to 22:10 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 05:39 to 07:55 | VIDEO |
Adv Digital Signal Processing - Multivariate and wavelets (View More...)
| The Polyphase Approach The Modulation Approach | lec36 | 01:25 to 07:07 | VIDEO | |
| The Polyphase Approach The Modulation Approach | lec36 | 13:30 to 14:27 | VIDEO | |
| The Polyphase Approach The Modulation Approach | lec36 | 20:35 to 22:24 | VIDEO |
Advanced Optical Communication (View More...)
| Signal Distortion III | lec10 | 06:18 to 18:15 | VIDEO | |
| Signal Distortion III | lec10 | 22:43 to 29:00 | VIDEO | |
| Practical issues in Implementation of Fiber Link | lec11 | 07:23 to 11:17 | VIDEO |
High Speed Devices and Circuits (View More...)
| MBE and LPE for GaAs Epitaxy | lec10 | 55:23 to upto | VIDEO | |
| GaAs and InP devices for Microelectronics | lec11 | 03:37 to 05:27 | VIDEO | |
| GaAs and InP devices for Microelectronics | lec11 | 05:44 to 13:44 | VIDEO |