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Electronics-and-communication-engineering0
Analog IC Design (View More...)
| Components available in a CMOS process | lec20 | 00:18 to 06:48 | VIDEO | |
| Components available in a CMOS process | lec20 | 06:48 to 10:56 | VIDEO | |
| Components available in a CMOS process | lec20 | 10:56 to 17:51 | VIDEO |
Transmission Lines and EM Waves (View More...)
| Boundary Conditions at Media Interface | lec20 | 11:38 to 14:55 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 14:55 to 16:56 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 20:20 to 23:02 | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 53:26 to 56:42 | VIDEO | |
| Interface Electronics for MEMS | lec31 | 04:16 to 09:59 | VIDEO | |
| Interface Electronics for MEMS | lec31 | 09:59 to 14:13 | VIDEO |
High Speed Devices and Circuits (View More...)
| GaAs and InP devices for Microelectronics | lec11 | 27:43 to 30:46 | VIDEO | |
| (a) Fermi level pinning (b) I-V Characteristics of Schottky Barrier Diodes | lec16 | 02:37 to 05:22 | VIDEO | |
| (a) Fermi level pinning (b) I-V Characteristics of Schottky Barrier Diodes | lec16 | 05:22 to 10:25 | VIDEO |