Engineering Chemistry I (View More...)
| Module 1 Atoms and Molecules Hydrogen Atom | lec6 | 32:32 to 37:10 | VIDEO | |
| Module 1 Atoms and Molecules Hydrogen Atom | lec6 | 49:45 to 51:28 | VIDEO | |
| Module 1 Atoms and Molecules Hydrogen Atom | lec6 | 57:15 to upto | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 05:39 to 07:55 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 17:04 to 19:18 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 21:23 to 23:29 | VIDEO |
VLSI Technology (View More...)
| Annealing of damages created by Ion-implantations | lec21 | 24:40 to 32:40 | VIDEO | |
| Annealing of damages created by Ion-implantations | lec21 | 35:40 to 38:04 | VIDEO | |
| Etching of Si, SiO2, SiN and other materials. | lec28 | 13:41 to 17:04 | VIDEO |