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Electronics-and-communication-engineering0
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MEMS and Microsystems (View More...)
| Micromachining Technology for MEMS | lec10 | 04:05 to 10:38 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 31:48 to 34:58 | VIDEO | |
| MEMS Materials Properties (Cont.) and Microelectronic Technology for MEMS - I | lec7 | 49:50 to 51:08 | VIDEO |
VLSI Circuits (View More...)
| System Design Examples (Continued) | lec44 | 11:53 to 12:52 | VIDEO | |
| System Design Examples (Continued) | lec44 | 12:52 to 14:42 | VIDEO | |
| System Design Examples (Continued) | lec44 | 14:42 to 16:39 | VIDEO |
VLSI Technology (View More...)
| Molecular Beam Epitaxy | lec10 | 25:54 to 35:06 | VIDEO | |
| Molecular Beam Epitaxy | lec10 | 35:06 to 39:24 | VIDEO | |
| Oxidation II - Oxidation Rate Constants | lec12 | 23:39 to 30:58 | VIDEO |
High Speed Devices and Circuits (View More...)
| MBE and LPE for GaAs Epitaxy | lec10 | 02:23 to 03:26 | VIDEO | |
| MBE and LPE for GaAs Epitaxy | lec10 | 08:34 to 09:29 | VIDEO | |
| MBE and LPE for GaAs Epitaxy | lec10 | 09:29 to 11:40 | VIDEO |