Coding Theory (View More...)
| BCH and RS codes I | lec13 | 47:18 to 01:02 | VIDEO | |
| Union Bound, Recursive Convolutional Encoders | lec32 | 07:16 to 17:13 | VIDEO | |
| Union Bound, Recursive Convolutional Encoders | lec32 | 39:33 to upto | VIDEO |
Digital Circuits and Systems (View More...)
| J-K and T Flip Flops | lec18 | 11:15 to 19:00 | VIDEO | |
| J-K and T Flip Flops | lec18 | 19:00 to 26:05 | VIDEO | |
| J-K and T Flip Flops | lec18 | 26:05 to 28:29 | VIDEO |
Electromagnetic Field (View More...)
| lec14 | lec14 | 22:35 to 26:02 | VIDEO | |
| lec18 | lec18 | 12:52 to 20:40 | VIDEO | |
| lec23 | lec23 | 28:13 to 35:48 | VIDEO |
Engineering Physics II (View More...)
| Module No. # 03 | lec12 | 28:31 to 34:07 | VIDEO | |
| Module No. # 03 | lec12 | 37:02 to 39:36 | VIDEO | |
| Module No. # 03 | lec13 | 06:53 to 11:03 | VIDEO |
Circuits for Analog System Design (View More...)
| Capacitive Sensor Circuit with High impedance Amplifier | lec32 | 01:11 to 02:43 | VIDEO | |
| Capacitive Sensor Circuit with High impedance Amplifier | lec32 | 02:43 to 04:29 | VIDEO | |
| Capacitive Sensor Circuit with High impedance Amplifier | lec32 | 04:42 to 04:57 | VIDEO |
MEMS and Microsystems (View More...)
| Mems Inertial Sensors | lec20 | 07:40 to 11:03 | VIDEO | |
| Temperature Drift and Damping Analysis | lec23 | 12:56 to 15:57 | VIDEO | |
| Temperature Drift and Damping Analysis | lec23 | 15:57 to 18:21 | VIDEO |
High Speed Devices and Circuits (View More...)
| Requirements for High Speed Circuits, Devices and Materials | lec2 | 03:45 to 04:48 | VIDEO | |
| Requirements for High Speed Circuits, Devices and Materials | lec2 | 04:48 to 09:04 | VIDEO | |
| Requirements for High Speed Circuits, Devices and Materials | lec2 | 09:04 to 10:30 | VIDEO |
VLSI Data Conversion Circuits (View More...)
| High Order DSMs | lec23 | 00:18 to 05:44 | VIDEO | |
| High Order DSMs | lec23 | 26:14 to 29:39 | VIDEO | |
| High Order DSMs | lec23 | 43:32 to 46:11 | VIDEO |