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MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 27:55 to 31:48 | VIDEO | |
| Applications of MEMS | lec4 | 53:41 to 55:54 | VIDEO | |
| MEMS Materials | lec5 | 02:04 to 07:42 | VIDEO |
VLSI Technology (View More...)
| Plasma Deposition Process | lec29 | 40:39 to upto | VIDEO | |
| Problems in Aluminium Metal Contacts | lec31 | 10:37 to 11:38 | VIDEO | |
| Problems in Aluminium Metal Contacts | lec31 | 11:38 to 13:19 | VIDEO |
High Speed Devices and Circuits (View More...)
| GaAs and InP devices for Microelectronics | lec11 | 05:44 to 13:44 | VIDEO | |
| Ohmic Contacts on Semiconductors | lec15 | 20:34 to 26:51 | VIDEO | |
| MESFET: Velocity Field Characteristics and Velocity | lec27 | 32:02 to 34:40 | VIDEO |