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Digital Voice and Picture Communication (View More...)
| Computational Aspects of LPC Parameters | lec11 | 2:02 to 4:32 | VIDEO | |
| H dot 264: Advanced Coding Aspects | lec27 | 14:06 to 16:30 | VIDEO | |
| H dot 264: Advanced Coding Aspects | lec27 | 22:08 to 25:31 | VIDEO |
MEMS and Microsystems (View More...)
| Polymer MEMS and Carbon Nano Tubes CNT | lec29 | 57:54 to upto | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 05:39 to 07:55 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 17:04 to 19:18 | VIDEO |