Engineering Physics II (View More...)
| Module No. # 03 | lec13 | 46:19 to 48:39 | VIDEO | |
| Module No. # 03 | lec15 | 04:55 to 09:00 | VIDEO | |
| Module No. # 03 | lec15 | 12:22 to 15:52 | VIDEO |
Transmission Lines and EM Waves (View More...)
| Boundary Conditions at Media Interface | lec20 | 11:38 to 14:55 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 14:55 to 16:56 | VIDEO | |
| Boundary Conditions at Media Interface | lec20 | 20:20 to 23:02 | VIDEO |
MEMS and Microsystems (View More...)
| Wafer Bonding and Packaging of MEMS | lec30 | 40:51 to 43:29 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 56:42 to upto | VIDEO | |
| Interface Electronics for MEMS | lec31 | 04:16 to 09:59 | VIDEO |
RF Integrated Circuits (View More...)
| Resistor, Capacitors | lec7 | 36:36 to 44:52 | VIDEO | |
| Resistor, Capacitors | lec7 | 51:12 to 57:13 | VIDEO | |
| Resistor, Capacitors | lec7 | 57:13 to 1:04: | VIDEO |
VLSI Circuits (View More...)
| Introduction to VLSI Design | lec1 | 09:53 to 24:01 | VIDEO | |
| Xilinx Place and Route Tool (Continuedâ¦) | lec35 | 40:41 to 44:22 | VIDEO | |
| Xilinx Place and Route Tool (Continuedâ¦) | lec35 | 44:22 to 48:50 | VIDEO |
VLSI Technology (View More...)
| Oxidation I Kinetics of Oxidation | lec11 | 5:56 to 9:59 | VIDEO | |
| Oxidation III Dopant Redistribution | lec13 | 10:20 to 12:23 | VIDEO | |
| Oxidation III Dopant Redistribution | lec13 | 13:05 to 15:17 | VIDEO |
Adv Digital Signal Processing - Multivariate and wavelets (View More...)
| The Theorem of (DYADIC) Multiresolution Analysis | lec25 | 44:18 to 45:19 | VIDEO | |
| The Haar Multiresolution Analysis | lec3 | 31:41 to 33:22 | VIDEO | |
| The Haar Multiresolution Analysis | lec3 | 33:22 to 36:51 | VIDEO |
VLSI Data Conversion Circuits (View More...)
| Introduction to Data Conversion | lec1 | 00:11 to 07:46 | VIDEO | |
| Introduction to Data Conversion | lec1 | 29:55 to 51:04 | VIDEO | |
| ADC/DAC Definitions | lec15 | 20:26 to 31:36 | VIDEO |